Maro Publications

High Temperature Materials

Notes

Patent Titles

*04/14/2015 
from 10/23/2013

Maro Encyclopedia

Materials

xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx 

Notes

1. Problems

2. Epoxy Materials

3. High Temperature Gaskets

xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx 

Notes

1. Problems

“Conventionally, as a light-weight material for construct having heat resistance, fiber-reinforced plastics (hereafter referred to also as FRP) having various heat-resistant resins such as polyimide as a matrix have been developed mainly as a material for aerospace purposes. However, these heat-resistant resins such as polyimide are inferior in the formability and economy to epoxy resins for general purposes. For this reason, it has not been general to apply these heat-resistant resins, for example, to the field of vehicles, construction, and the like other than the materials for aerospace purposes.

Also, heat-resistant FRP using a phenolic resin, in particular a resol-type phenolic resin, is known in the art. However, these are produced by dehydration condensation of a resol-type phenolic resin with an acid catalyst, and are therefore porous to have insufficient strength.

On the other hand, an epoxy resin is excellent in formability and economy, and also has an extremely good adhesion property with carbon fiber, so that the epoxy resin has excellent characteristics as a matrix of FRP. However, conventional epoxy resins do not necessarily have sufficient heat resistance, and it has been difficult to ensure a high heat resistance of, for example, 250.degree. C. or more. “

[High Temperature Plastics, US Patent 8,530,053 (9/10/2013)]

xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx 

2. Epoxy Materials

In molding large structures, dimensionally accurate master models and tools are used.  Models and tools with low production costs, faster processing and smoother surfaces are needed.  Cleaver developed a method for making high temperature resistant models and tools.  Structures are formed on substrates by depositing several adhesive layers of curable paste.  The same curable paste is used as topcoat or sealer.  This paste is dispensed from a mixer as continuous layers onto a substrate with a machine.   The composition can contain a resin, a filler, a thixotropy agent and hardeners.  The thixotropic agent consists of polyethyleneimine and an amine having at least two amine hydrogen groups.  The two amines also are crosslinking agents for the epoxy resin.

U.S. Patent 8,540,840 (September 24, 2013), “Method of Making High Temperature Resistant Models or Tools,” Matthew Cleaver (Huntsman Advanced Materials Americas LLC, The Woodlands, Texas, USA).

xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx 

3. High Temperature Gaskets

In downhole oil drilling and oil wells , elastomer gaskets are used in applications such as packer elements, blow out preventer elements, o-rings, and gaskets.  These elastomers are exposed to high temperatures and harsh chemical and mechanical environments that degrade performance and reliability. 

Duan, Agrawal, and Gerrard developed a crosslinked polyarylene with  high-temperature elastomeric properties and excellent chemical resistance.  The polyarylene consists of aromatic hydrocarbon rings with functional groups for crosslinking.  The new elastomers have a glass transition above room temperature, but lower than the minimal application temperature.  The crosslinked materials are useful in oil and gas downhole applications in the form of either solids or foams.  The crosslinked polyarylenes, are prepared by oxidative crosslinking in the presence of a molecular crosslinking agent.

US Patent 8,940,841 (January 27, 2015), “Polyarylene Compositions, Methods of Manufacture, and Articles thereof,” Ping Duan, Gaurav Agrawal, and David P. Gerrard (Baker Hughes Incorporated, Houston, Texas, USA).

xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx 

Patent Titles

11/5/2013 

6. 8,575,249 
High heat-resistant polygermane compound with sulfur-containing organic group 

5. 8,574,462 
High temperature stable polyelectrolytes having backbone aromatic groups 

9/24/2013 

4. 8,541,691 
Heat resistant substrate incorporated circuit wiring board 

3. 8,541,099 
Heat-resistant resin 

9/10/2013 

2. 8,530,053 
Heat-resistant composite material 

7/9/2013 

1. 8,481,638 
High temperature PP adhesive 

xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx

Interested!!
Bookmark this page to follow future developments!.
(RDC 7/16/2012)

 xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx

Roger D. Corneliussen
Editor
www.maropolymeronline.com

Maro Polymer Links
Tel: 610 363 9920
Fax: 610 363 9921
E-Mail: cornelrd@bee.net  

***********************************

Copyright 2013 by Roger D. Corneliussen.
No part of this transmission is to be duplicated in any manner or forwarded by electronic mail without the express written permission of Roger D. Corneliussen
**************************************

* Date of latest addition; date of first entry is 10/23/2013.